Application Arrangement
Margin Deposit:	10% for each application
Margin Interest Rate:	For loan amount from $100,000 to $3,000,000: 1.60%p.a. For loan amount more than $3,000,000: 1.38%p.a. Min loan amount $100,000 / Min Qty 70,000 shares
Handling Charge:	HK$100
Commission and HKEX charges:	1% and 0.009% respectively
Application Methods:	(1) Make phone call to the account executives or branches (2) Go to any branch of Taifook Securities Co. Ltd (3) Apply through Taifook's eIPO
Application Deadline:	Financing: 16 March 2010 (3:00pm) Tuesday Fully Paid: 16 March 2010 (4:00pm) Tuesday

Customer Hotline：3583 3388

• Applicant should have effective Hong Kong address & not a legal or natural person in PRC or US & the total number of joint applicants may not exceed 4 for the IPO application.
• Application by phone call service is only applicable to Yellow Application Form Applicants.
• Margin trade is only applicable to margin account holders with Taifook Securities Co. Limited.
• The final interest rate for margin trade will be confirmed at the cut-off date of the IPO application.
• Taifook Securities Co. Limited reserves the right to approve any margin application.
• Taifook Securities Co. Limited reserves the right to adjust the interest rates, financing percentages and margin limits at any time without prior notice.
• Above information is for your reference only. You are advised to make decision to invest in the Company only on the basis of the contents of the prospectus of the Company.

1. Potential investors should read the prospectus for detailed information about the company and the proposed offering before deciding whether or not to invest in the shares or debentures concerned. The above information does not form part of the relevant prospectus and the securities are offered solely on the basis of information contained in that prospectus.
2. The above information does not constitute an offer or an invitation to induce an offer by any person to acquire, subscribe for or purchase the shares or debentures concerned.